electronic product application

Case in Electronic Products Industry

—Hot melt adhesive machines address bonding challenges in electronics manufacturing through efficiency, eco-friendliness, and precision, driving intelligent upgrades and sustainable development.Get a Quote

Pain points of traditional processes

Long Curing Time: Solvent-based or UV adhesives require curing time, slowing production.

Environmental Concerns: VOCs in traditional adhesives cause pollution and regulatory risks.

Complex Operation: Manual mixing and application lead to uneven bonding or overflow.

Poor Heat Resistance: Adhesives degrade in high-temperature environments, reducing product reliability.

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Advantages of Hot Melt Adhesive Machines for Electronic Industry

Instant Curing
Hot melt adhesives solidify within seconds, accelerating production.
Eco-Friendly
Zero VOC emissions, compliant with RoHS/REACH regulations.
Precision Application
Automated control ensures consistent glue volume and placement.
Versatile Performance
Resistant to heat and vibration, ideal for PCBs, cables, enclosures, etc.
Cost Efficiency
Over 95% material utilization reduces labor and operational costs.

After-sale Service

01
Arrange training on how to install the machine and how to use it.
02
Engineers provide guidance on how to calibrate machines.
03
7*24 online customer service to assist in resolving product issues.
04
If any accessories malfunction during the warranty period, relevant accessories can be sent free of charge.

Suzhou Oushida Hot Melt Machinery Equipment Co., Ltd.

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Applications

Hot Melt Glue

About Oushida

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Case in Electronic Products Industry

Pain points of traditional processes

Advantages of Hot Melt Adhesive Machines for Electronic Industry

Instant Curing

Eco-Friendly

Precision Application

Versatile Performance

Cost Efficiency

After-sale Service

Price Your Hot Melt Glue Machine Now! Tel: +8613913105882|Email: osd@szosd.tech

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